Key technical parameters confirmed by testing:
Test Method ASTM D 2671:
Tensile strength: ≥ 14 MPa
Elongation at break: ≥ 400%
Elongation at break after heat aging (+150°C, 168h): ≥ 300%
Influence on copper: Non-corrosive
Cold bend (-55°C, 4h): No cracking
Test Method UL 224:
Longitudinal change after recovery: 0% to -10%
Test Method IEC 243:
Dielectric strength: ≥ 20 kV/mm
Test Method IEC 93:
Volume resistivity: ≥ 1014 Ω⋅ cm
Test Method ASTM D 1693:
Stress cracking resistance (+50°C): No cracking
Test Method ISO 62:
Water absorption: < 0.1%
Test Method ASTM E 28:
Softening point: 80°C
Test Method ASTM D 1000:
Peel strength: 50 N / 25 mm
Test Method ISO 846:
Fungus resistance: Resistant